Ceramic Hybrid Ic Packaging

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Ceramic hybrid ic packaging.

At the same time the vacuum tight housings and substrates must. Packaging and electronic assembly criteria labs offers a full array of ic packaging services from wafer dicing to assembly of gaas gan rf modules and high temperature mcm s. Other terms such as hybrid or hybrid. Twenty mil thick ultra.

Ic or integrated circuit packaging refers literally to the material that contains a semiconductor device. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Circular and slotted holes allow mechanical positioning. A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g.

Resistors inductors transformers and capacitors bonded to a substrate or printed circuit board pcb. Transistors diodes or monolithic ics and passive components e g. 0 010 pad spacing matches ic sensor. In support of our defense customers we are an itar registered facility accredited trusted supplier and dla mil prf 38535 certified assembly mfg.

Co 2 lasered ceramic with matching window frame. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. Plated holes enabling multiple conductor levels. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the pcb.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.