Leadless chip carrier sockets conform to jedec standards a b c and d.
Ceramic leadless chip carrier socket.
Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc.
Solder glass or epoxy seal.
28 44 52 68 84 and 124.
Socket or surface mount package.
The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in.
28 44 52 68 84 and 124.
Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.
Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.
Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.
Surface mount and soldertail options are available.
Gold or solder dip.
A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing.
Surface mount and soldertail options are available.
Heat sinks also available in six sizes.
Castellations instead external leads.
Leadless chip carriers are ideal for surface mount applications.
Generally speaking sockets for plcc chips j lead are not compatible with leadless chip carriers since their contacts are typically recessed between fingers that align and grip the plcc package itself.
The chip is held into the socket by friction.
Variety of body sizes.
Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action.
Low profile multilayer ceramic package.
Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact.
Leadless chip carrier sockets.
Leadless chip carrier sockets conform to jedec standards a b c and d.
Footprint compatible with cqjb and plcc.
Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket.
A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.
A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.
