Ceramic Dip Package

14 lead cerdip q 14 pdf. Like dip but with staggered zig zag pins. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm.

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Medical and healthcare.

Ceramic dip package.

Ceramic packages for large scale integration lsi devices. Ceramic substrates for probe cards. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Eprom ics in 0 6 wide ceramic dip 40 dip 32 dip 28 dip 24 packages also known as cdip ceramic dip 8 contact dip switch with 0 3 wide 16 pin dip 16n footprint in microelectronics a dual in line package dip or dil 1 or dual in line pin package dipp 2 is an electronic component package with a rectangular housing and two.

Cerdip ceramic q ceramic dual inline package glass seal package drawing q filter packages by entering lead count or product description into the search box below. Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. Non standard dip with smaller 0 07 in 1 78 mm pin spacing. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities.

Spst x 4 two complementary pairs per package. Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. Another example of a ceramic. Standard packages and lids for device evaluation.

7 62 mm or 0 6 inch 15 24 mm. Package outline material information. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Medical and healthcare.

Packages come in many forms including dip dual inline sip single inline and pga pin grid array pin insertion types and surface mount types including j lead flat lead gull wing leadless bga ball grid array lga land grid array csp chip size package and other types. And having a row spacing associated with body width varies depending on lead counts with 0 3 in. Material properties process flow. Spst x 4 two complementary pairs per package.

Both passive or active devices may be found using ceramic packages.

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